MCN QC 20 IC glue Remover

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Chemicals
450.00 350.00

Wishlist
  • BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
  • The ingredients of it is environmental protection and safe.
  • It has good permeability;
  • it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
  • BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
  • The ingredients of it is environmental protection and safe.
  • It has good permeability;
  • it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.

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